Tantalum Target
Product Tantalum Target/ Tantalum Disc (Ta Sputtering Target)
Part Number TRM-TA026
Shape Round/Square/Rectangular or As per drawings
Purity 99.9%, 99.95%, 99.99%
Density 16.68 g/cm3
CAS Number 7440-25-7

Tantalum sputtering target is used in electronic industry, the purity is up to 99.99%. We can offer various dimensions in round / square/ rectangular shape. Please contact us for more details. Our tantalum material is from Non-Conflict Resource.

Application: Sputtering Target

Thermostability 91%
Machinability 87%
Corrosion Resistance 90%
Inquiry

Order Information

Please include the following information with your inquires and orders:
1. Quantity
2. Dimensions or Drawings
3. Purity

Assay

Element  UNS R05200 UNS R05400
O 0.015% max 0.030% max
C 0.010% max 0.010% max
N 0.010% max 0.010% max
H 0.0015% max 0.0015% max
Fe 0.010% max 0.010% max
Ni  0.010% max  0.010% max
Si  0.005% max  0.005% max
Ti  0.010% max  0.010% max
Mo  0.020% max  0.020% max
W  0.050% max  0.05% max
Nb  0.100% max  0.100% max
Ta Remainder Remainder

* Higher Purity level: 99.95%, 99.99% is available.

Typical Size Available (Please inquire for details)

Shape Dimension Tolerance
Round Sputtering Target 0.6″  to 15″ diameter x 0.12″ to 1″ thickness +/-0.010″  or on request
Rectangular and Flat Sputtering Target 0.04″ to 1.5″ thickness x up to 39″ width x 115″ Length +/-0.010″  or on request

Please refer to Tantalum Sheet for regular sheet products.

Specifications for the Tantalum Sputtering Target

Item Specifications
Purity 99.9%, 99.95%, or 99.99%
Recrystallization 95％ min
Grain size 60 micron or ASTM 4 or better
Surface finish 16 RMS max. or Ra 0.4 (RMS 64 or better)
Flatness 0.15％ max

Physical Properties for Tantalum

Physical properties Tantalum (Atomic#73)
Phase Solid
Melting point 3290 K (3017°C, 5463°F)
Boiling point 5731 K (5458°C, 9856°F)
Heat of fusion 36.57 kJ/mol
Heat of vaporization 753 kJ/mol
Molar heat capacity 25.36 J/(mol•K)